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Our Services

Surface Mount Technology.
Lead Free ROHS
Down to 12 mil Ultra fine Pitch
Through Hole
Mixed Technology
BGA & micro BGA
100% Inspection
Chip Scale Packaging
Flip Chips
Flex Circuits
Thin Rigid Substrates
Double Sides and Intrusive Reflow Process
No Clean and Water Soluble Soldering Capabilities
In Circuit Testing
Functional Testing
Cable Fabrication
Box Build